In re Kuhn

This is an appeal from the decision of the Board of Appeals of the United States Patent Office affirming the decision of the Primary Examiner in rejecting, in view of the prior art, all of the claims in Appellants’ application for a patent. The alleged invention relates to expansible wafers and has among its objects to provide a wafer which alone constitutes a thermal responsive unit.

Of the appealed claims, Nos. 13, 15, 18, 20, 21, and 22 are for the device and 8 and 9 are for the method of making it.

Claims 8, 15, and 18 are illustrative and read as follows:

8. The method of forming a…