Electronic Molding Corp. v. Mupac Corp.

MEMORANDUM

CAFFREY, Chief Judge.

This is a civil action brought by the plaintiff Electronic Molding Corporation (EMC) against the defendant Mupac Corporation (Mupac) for alleged infringement of United States Design Letters Patent Number 223,-109 (109) and United States Patent Number 3,784,96s. 1 Jurisdiction is founded on 28 U.S.C. § 1338(a).

The case came before the Court for a non-jury trial. At the close of the plaintiff’s case-in-chief, which consisted solely of the inventor’s testimony, the defendant Mupac moved for dismissal of the 109 infringement claim pursuant to Fed.R.Civ.P. 41(b).…