Abstract
The scaling of package and circuit board dimensions is central to heterogeneous system integration. We describe our solderless direct metal-to-metal low pressure (< 70 MPa) and low temperature (< 250 ⁰C) thermal compression bonding (TCB) technique and present preliminary results of dielet (4 -25 mm 2 area) attach to a rigid Silicon Interconnect Fabric (Si-IF) with up to two levels of wiring (2 -10 µm pitch). Dielets were attached at a pitch ≤ 10 µm with an inter-dielet spacing of ≤ 100 µm . We show an effective specific contact resistance of < 1 Ω-µm 2 and shear strength of > 20 MPa. The combined reduction of dielet interconnect pitch, dielet-to-dielet spacing and trace pitch will enable a Moore's law for packaging.
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