Authors
Shirzadi, Amir A.
Topics
Epoxy Resin Curing Processes3D IC and TSV technologiesComposite Material MechanicsAugust 2024 Welding and Joining Matters 13
About
PublishedAug 1, 2024
TypeArticle
Citations0
Publication
Fundamentals of solid-state diffusion bonding
Aug 1, 2024 · 1 author · 4 topics
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