Patent
Polyimide varnish composition for flexible substrate and polyimide film using same (US Patent 11965110)
NEXFLEX CO., LTD. · Granted Apr 23, 2024 · Filed Dec 27, 2021
Patent number: 11965110 Kind code: B2 Granted: 2024-04-23 Filed: 2021-12-27 Inventors: So Jeong Kim (Daejeon, KR); Joo Young Kim (Sejong-si, KR); Hyuk Jun Kim (Daejeon, KR) Assignees: NEXFLEX CO., LTD. (Chungcheongbuk-Do, KR) CPC: C03C 17/32; C08G 73/1042; C08G 73/1085; C08J 2379/08; C08J 5/18
Abstract
The present disclosure relates to a polyimide varnish composition for a flexible substrate and a polyimide film using the same, and a polyimide varnish composition for a flexible
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